71NW10GC3D
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71NW10GC3D , Winbond

Manufacturer: Winbond
Mfr.Part #: W71NW10GC3DW
Package:
RoHS:
Datasheet:

PDF For W71NW10GC3DW

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Description:
Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x8/x32
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Specifications
Product Attribute Attribute Value
Manufacturer Winbond
Product Category Multichip Packages
RoHS
Type NAND Flash, LPDDR1
Maximum Clock Frequency 29 MHz, 200 MHz
Data Bus Width 8 bit, 32 bit
Organization 128 M x 8, 16 M x 32
Mounting Style SMD/SMT
Product Type Multichip Packages
Memory Size 1 Gbit, 512 Mbit
Minimum Operating Temperature - 40 C
Maximum Operating Temperature + 85 C
Supply Voltage - Min 1.7 V
Supply Voltage - Max 1.95 V
Moisture Sensitive Yes
Series W71NW10GC
Packaging Tray
Brand Winbond
Factory Pack Quantity 2500
Subcategory Memory & Data Storage
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